Job Description

The student, as part of the BE DEV APT APD and under the guidance of an assigned mentor will undertake projects on the improvement of Board level Reliability (BLR) performanace of IC packages by new material and design, such as solder alloy, solder paste, SMT conditions, and PCB land pattern and stencil design. The role focuses on experimental analysis and modeling to enhance package durability under stress conditions. The role also leverages interns technical foundation in advanced materials engineering/sciences.

Job Description

In your new role you will:

Conduct the experiment involving SMT

(surface mount), BLR (Board level Reliability), and FA (Failure Analysis)

Perform statistical data analysis on the failure rate

Conduct literature review

, write technical papers, and review / revise specification

Perform Mechanical simulation using ANSYS

and package modelling using SOLIDWOR +

Materials & Process Optimization

: Investigate PCB substrates, solder alloys (including novel compositions), solder pastes, and land pattern designs to improve BLR performance.
+

Experimental Execution

: Design and conduct lab experiments for 2nd-level reliability assessments, including thermal cycling and mechanical stress tests on new solder alloys.
+

Technical Synthesis

: Review scientific literature and summarize data on solder ball alloy reliability, identifying improvement opportunities.
+

Simulation & Modeling

: Apply ANSYS mechanical modeling to correlate experimental data with predictive simulations of stress distribution and failure modes. This expertise is desirable but not absolutely necessary


Learning outcomes:

Hand-on experience in SMT, BLR, and FA Analysis of experimental data using statistical techniques Literature review and technical paper publication Mechanical Simulation with ANSYS and Package modelling with SOLIDWORKS

Your Profile

You are best equipped for this task if you have:

Currently studying PhD or Masters

in Electrical & Electronic / Material Science / Mechanical / Computer Engineering

with a research-oriented mindset. A strong understanding of material science, especially alloy composition and properties, phase diagram, microstructure and intermetallic alloy affecting solder joint integrity Knowledge in solder process and technique to improve the reliability Strong background in failure analysis techniques, including X-Ray, Micro sectioning, and stress tests Familiar with FEA simulation and CAD software such as SOLIDWORK

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Employment at Infineon is contingent upon proof of your legal right to work in the United States under applicable law, verification of satisfactory references and successful completion of a background check and drug test, and signing all your on-boarding documents.



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