Job Description

Purpose of Position Establishment

The Dicing Process Engineer plays a critical role in enabling high-yield, high-precision wafer singulation for advanced semiconductor and photonics products. This position is essential to the company’s mission of delivering cutting-edge microfabrication solutions by developing robust, scalable, and cost-effective dicing processes for glass and silicon substrates. The engineer will drive innovation in wafer-level processing, support new product introductions, and ensure manufacturing excellence through continuous process improvement.

Job Responsibilities

1.Process Development and Optimization

1.1 Develop and refine dicing processes for glass and silicon wafers using blade dicing, laser dicing, stealth dicing, or plasma dicing,die-attach, piece-to-substrate, piece-to-piece techniques.



1.2 Evaluate and select appropriate dicing methods based on wafer material, thickness, die size, and product requirements.



1.3 Design and execute DOE (Design of Experiments) to optimize dicing parameters such as spindle speed, feed rate, blade type, cooling methods, and laser settings.



1.4 Collaborate with cross-functional teams (R&D, packaging, quality, and equipment engineering) to integrate dicing processes into the overall manufacturing flow.

2.Equipment and Tooling

2.1 Specify, help install, and qualify dicing equipment (e.g., DISCO, ADT, or laser dicing systems).



2.2 Manage blade/tool selection and monitor tool wear and performance.



2.3 Troubleshoot equipment issues and implement corrective actions to minimize downtime and improve process stability.

3.Metrology and Characterization

3.1 Perform post-dicing inspection using optical microscopy, SEM, and surface profilometry to assess edge quality, chipping, kerf width, and die integrity.



3.2 Analyze dicing-induced damage and implement mitigation strategies.



3.3 Monitor and control particle contamination on wafer and wafer breakage rates.

4.Yield and Reliability

4.1 Drive yield improvement initiatives by identifying root causes of dicing-related defects and implementing process changes.



4.2 Support reliability testing and failure analysis related to dicing-induced stress or damage.



4.3 Maintain detailed documentation of process recipes, test results, and improvement actions.

5. Safety and Compliance

5.1 Ensure all dicing operations comply with safety standards and cleanroom protocols.



5.2 Maintain equipment and process documentation in accordance with ISO and internal quality systems.

Qualifications

Basic Requirements

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or related field.

Work Experience

1.Minimum 5 years of hands-on experience in wafer dicing process development, preferably in semiconductor or photonics industries.



2. Proven track record of developing and scaling dicing processes for glass and silicon wafers.

Knowledge and Skills

1. Deep understanding of wafer materials, mechanical properties, and dicing-induced stress.



2. Proficient in common tools such as IE, SPC, PFMEA, CP, MSA, and NPI.



3. Familiarity with cleanroom practices and wafer handling protocols.



4. Strong problem-solving and communication skills.

Professional Qualities

Strong teamwork spirit, sense of responsibility, results-oriented mindset, and practical work ethic.